Review paper: Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)

Current Applied Physics

Volumn 13, Issue 4 SUPPL.2, 2013, Pages

  Kim, Sun Chul ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Anisotropic conductive film; Flip chip bonding; Nonconductive adhesive

Indexed keywords

ADHESIVES; ANISOTROPY; CHIP SCALE PACKAGES; CONDUCTIVE FILMS; ENVIRONMENTAL TECHNOLOGY; POLYMER FILMS; SEMICONDUCTING FILMS; SOLDERING; TEMPERATURE;

ANISOTROPIC CONDUCTIVE FILMS; ELECTRICAL INTERCONNECTIONS; ENVIRONMENTAL FRIENDLINESS; FINE-PITCH CAPABILITY; FLIP CHIP ASSEMBLIES; FLIP CHIP BONDING; LOW- TEMPERATURE PROCESS; NON-CONDUCTIVE ADHESIVES;

FLIP CHIP DEVICES;

EID: 84890565973     PISSN: 15671739     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.cap.2013.05.009     Document Type: Article

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