Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 3, 2004, Pages 608-615

  Jang, Kyung Woon ^a   Kwon, Woon Seong ^a   Yim, Myung Jin ^b   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Telephus Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; FILLERS; GLASS TRANSITION; MECHANICAL PROPERTIES; RELIABILITY; RHEOLOGY; SILICA; TEMPERATURE; THERMAL CYCLING; THERMAL EXPANSION; VISCOSITY;

DILUENT; NONCONDUCTIVE PASTE; SILICA FILLER; STUD BUMP;

FLIP CHIP DEVICES;

EID: 4444305289     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.832054     Document Type: Article

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