Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1176-1180

  Caers, J F J M ^a   Zhao, X J ^a   Wong, E H ^b   Ong, C K ^b   Wu, Z X ^b   Ranjan, R ^b  

^a PHILIPS RESEARCH LABORATORIES   (Germany)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; BONDING; COMPUTER SIMULATION; ELECTRIC RESISTANCE; FAILURE ANALYSIS; FINITE ELEMENT METHOD; MOISTURE; RELIABILITY; STRESS RELAXATION;

FLEX INTERCONNECTIONS; MICROFORCE TESTER; NONCONDUCTIVE ADHESIVES;

FLIP CHIP DEVICES;

EID: 0038012352     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Lai, Z., et al, "Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit systems", IEEE Trans-CPMT-B, Vol.19, 1996, pp. 644-660
2. Palm, J., et al, "Reliability of 80 μm pitch flip chip attachment on flex", Microelectronics Reliability, Vol. 40, 2001, pp. 633-638
3. Caers, J.F.J.M. et al, "Moisture Induced Failures in Flip Chip on Flex Interconnections using Anisotropic Conductive Adhesives" Proc International IEEE Conference on the Business of Electronic Product Reliability and Liability, Hong Kong and Shenzhen, January 2003, pp 171-176
4. "In-Situ Technique for Innovative Reliability Assessment of Advanced, High Density Electrical Interconnections (ITERELCO)", Brite/Euram project 97-4914, Contact nr. BRPR-CT98-0714