Adhesion strength and contact resistance of flip chip on flex packages - Effect of curing degree of anisotropic conductive film

Microelectronics Reliability

Volumn 44, Issue 3, 2004, Pages 505-514

  Uddin, M A ^a   Alam, M O ^a   Chan, Y C ^a   Chan, H P ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANISOTROPY; BONDING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC CONDUCTIVITY; EPOXY RESINS; FRACTURE; IMPREGNATION; SCANNING ELECTRON MICROSCOPY;

ADHESION STRENGTH; CONTACT RESISTANCE;

CONDUCTIVE FILMS;

EID: 1142288200     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00185-9     Document Type: Article

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