Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications

International Journal of Adhesion and Adhesives

Volumn 27, Issue 1, 2007, Pages 77-84

  Yim, Myung Jin ^a   Hwang, Jinsang ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Durability; Epoxy; Glass; Insulation resistance; Thermal analysis

Indexed keywords

AGGLOMERATION; ANISOTROPY; BINDING ENERGY; INSULATION;

ANISOTROPIC CONDUCTIVE FILMS (ACFS); CHIP-ON-GLASS (COG) APPLICATION; NONCONDUCTIVE FILM (NCF); SUBSTRATE PAD;

CONDUCTIVE FILMS;

ANISOTROPY; BONDING; MONOLAYERS; VISCOSITY;

EID: 33748790398     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2005.12.006     Document Type: Article

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