Wafer level packages (WLPs) using pre-applied anisotropic conductive films (ACFs)

6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Polytronic 2007, Proceedings

Volumn , Issue , 2007, Pages 153-158

  Paik, Kyung Wook ^a   Son, Ho Young ^a   Chung, Chang Kyu ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; CHIP SCALE PACKAGES; CMOS INTEGRATED CIRCUITS; CONDUCTIVE FILMS; CONTACT RESISTANCE; COPPER PLATING; DATA COMPRESSION; ELECTROCHEMISTRY; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONIC EQUIPMENT TESTING; ELECTRONICS INDUSTRY; ELECTROPLATING; FLAT PANEL DISPLAYS; FLIP CHIP DEVICES; GOLD; MECHANICAL PROPERTIES; METALS; MICROELECTRONICS; PHOTONICS; POLYMERS; PROCESS ENGINEERING; SUBSTRATES; WAFER BONDING;

ANISOTROPIC CONDUCTIVE FILMS; CHIP-ON-BOARD; CHIP-ON-FLEX; COMPRESSION METHODS; DEVICE PERFORMANCES; FLIP CHIPPING; FLIP-CHIP ASSEMBLIES; FLIP-CHIP JOINTS; FLIP-CHIP PACKAGING; GREEN PACKAGING; LOWER COST; ORGANIC SUBSTRATES; PACKAGING TECHNOLOGIES; PRESSURE COOKER TEST; SEMICONDUCTOR PACKAGING; SINGLE CHIPS; SINGULATION; SUBSTRATE METALS; WAFER LEVELS; WAFER-LEVEL PACKAGE; WAFER-LEVEL PACKAGING;

ELECTRONICS PACKAGING;

EID: 49949089649     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2007.4339158     Document Type: Conference Paper

References (9)

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