Wafer level ACA packages and their applications to advanced electronic packaging

10th Electronics Packaging Technology Conference, EPTC 2008

Volumn , Issue , 2008, Pages 450-456

  Paik, Kyung Wook ^a   Son, Ho Young ^a   Kim, Il ^a   Chung, Chang Kyu ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ADHESIVE PASTES; ANISOTROPY; APPLICATIONS; CONDUCTIVE FILMS; ELECTRONIC EQUIPMENT MANUFACTURE; FLAT PANEL DISPLAYS; FLIP CHIP DEVICES; GOLD; IMAGE SENSORS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; STUDS (STRUCTURAL MEMBERS); SUBSTRATES; TECHNOLOGY; THREE DIMENSIONAL; WAFER BONDING;

6 INCH WAFERS; ANISOTROPIC CONDUCTIVE ADHESIVES; CMOS IMAGE SENSORS; DEVICE PERFORMANCE; DIAMOND SAWING; ELECTRONIC PACKAGING; EMBEDDED ACTIVES; FLIP CHIPS; FLIP-CHIP ASSEMBLIES; GREEN PACKAGING; LCD DRIVERS; LOWER COSTS; MATERIALS AND PROCESS; MECHANICAL PERFORMANCE; MEMORY CHIPS; ORGANIC BOARDS; ORGANIC SUBSTRATES; PACKAGING TECHNOLOGIES; PROCESS PARAMETERS; PROCESSING STEPS; SEMICONDUCTOR PACKAGING; SINGLE CHIPS; SINGULATION; STUD-BUMPS; SUBSTRATE METALS; THERMO COMPRESSIONS; THERMO-COMPRESSION BONDINGS; THROUGH-SI VIA; ULTRA-FINE PITCHES; VERTICAL INTERCONNECTIONS; WAFER DICING; WAFER LEVEL PACKAGES; WAFER LEVELS;

CHIP SCALE PACKAGES;

EID: 63049127162     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2008.4763475     Document Type: Conference Paper

References (9)

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