Evaluation of a double-layer anisotropic conductive film (ACF) for fine pitch chip-on-glass (COG) interconnection

2005 6th International Conference on Electronics Packaging Technology

Volumn 2005, Issue , 2005, Pages 344-347

  Jia, Lei ^a   Ding, Han ^a   Sheng, Xinjun ^a   Xie, Bin ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; ELECTRONICS PACKAGING; LIQUID CRYSTAL DISPLAYS; OPTICAL RESOLVING POWER; THERMAL CYCLING;

ANISOTROPIC CONDUCTIVE FILMS (ACF); CHIP-ON-GLASS (COG) INTERCONNECTION; CONDUCTIVE PARTICLES;

CONDUCTIVE FILMS;

EID: 33846287923     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2005.1564729     Document Type: Conference Paper

References (10)

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10. Myung-jin Yim et al, Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications, Proceedings of 2005 International Symposium on Advanced Packaging Materials: Processes, Properities and Interfaces, March 16-18, 2005, pp.181-186