Reduced thermal strain in flip chip assembly on organic substrate using low cte anisotropie conductive film

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 3, 2000, Pages 171-176

  Yim, Myung Jin ^a   Jeon, Young Doo ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive film (acf); Cte mismatch; Electroless ni au bump; Flip chip; Nonconductive filler; Thermal strain

Indexed keywords

ANNEALING; ELECTRONICS PACKAGING; HARDNESS; INTERFEROMETRY; PRECIPITATION (CHEMICAL); STRAIN; STRESSES; SUBSTRATES; THERMAL EXPANSION; THIN FILMS;

ORGANIC SUBSTRATES;

FLIP CHIP DEVICES;

EID: 0034221347     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.873244     Document Type: Article

References (14)

1. [ l ] M. Dernevik et al., "Electrically conductive adhesives at microwave frequencies," in Proc. 48th Elec. Comp. Tech. Conf., 1998, pp. 1026-1030.
2. S. Asai et al., "Development of an anisotropic conductive adhesive film (ACAF) from epoxy resins," J. Appl. Polym. Sei., vol. 56, pp. 769-777', 1995.
3. H. Date et al., "Anisotropic conductive adhesive for fine pitch interconnections," in Proc. Int. Symp. Microelectron. '94, 1994, pp. 570-575.
4. A. Torri, M. Takizawa, and K. Sasahara Development of flip chip bonding technology using anisotropic conductive film," in Proc. 9th Int. Microelectron. Conf., 1996, pp. 324-327.
5. M. J. Yim and K. W. Paik The contact resistance and reliability of anisotropic conductive film (ACF)," IEEE Trans. Adv. Packag., vol. 22, pp. 166-173, May 1999.
6. K. Kulojarvi, P. Savolainen, and J. Kivilahti Bonding flexible circuits and bare chips with anisotropic electrically conductive and nonconductive adhesives," in Proc. 10th Eur. Microelectron. Conf., 1995, pp. 28-34.
7. D. J. Williams et al., "Anisotropic conductive adhesives for electronic interconnection," Solder Surface Mount Technol., pp. 4-8, 1993.
8. J. Kloeser et al., "Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology," IEEE Trans. Comp. Packag. Manufact. Technol. C, vol. 21, pp. 41-50, Jan. 1998.
9. S. Liang, S. R. Chong, and E. P. Giannelis Barium titanate/epoxy composite dielectric materials for integrated thin film capacitors," in Proc. 48th Elec. Comp. Tech. Conf., 1998, pp. 171-175.
10. S. Anhock et al., "Reliability of electroless nickel for high temperature applications," in Proc. Int., Symp. Adv. Packag. Mater., 1999, pp. 256-261.
11. A. H. Graham, R. W. Lindsay, and H. J. Read The structure and mechanical properties of electroless nickel,"/ Electrochem. Soc., vol. 112, no. 4, pp. 401-113, 1965.
12. D. Suryanarayana, T. Y. Wu, and J. A. Varcoe Encapsulants used in flip chip packages," in Proc. 43th Electron. Comp. Technol. Conf., 1993, pp. 193-198.
13. R. R. Tummala, Ed., Microelectronics Packaging Handbook, Part III Subsystem Packaging. New York: Chapman & Hall, 1997.
14. [ 14] Y. Guo étal. Solder ball connect assemblies under thermal loading-I: Deformation measurement via Moire interferometry, and its interpretation," IBM J. Res. Develop., vol. 37, no. 5, pp. 635-647, 1993.