Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF)

Key Engineering Materials

Volumn 326-328 I, Issue , 2006, Pages 517-520

  Park, Jin Hyoung ^a   Chung, Chang Kyu ^a   Paik, Kyung Wook ^a   Lee, Soon Bok ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Glass transition temperature; Moir interferometry; NCF (Non Conductive Film)

Indexed keywords

DEFORMATION; ELASTIC MODULI; FLIP CHIP DEVICES; INTERCONNECTION NETWORKS; INTERFEROMETRY; SHEAR STRENGTH; THERMAL EFFECTS;

CHIP EDGE; MOIRÉ INTERFEROMETRY; NCF (NON-CONDUCTIVE FILM); RESIDUAL WARPAGE;

GLASS TRANSITION;

EID: 33751547782     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-415-4.517     Document Type: Conference Paper

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