Effects of anisotropic conductive adhesive (ACA) material properties on package reliability performance [flip-chip interconnects]

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 718-725

  Teo, M ^a,b   Mhaisalkar, S G ^b   Wong, E H ^c   Teo, Poi Siong ^c   Wong, C C ^b   Ong, K ^b   Goh, Chin Foo ^b  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; ENVIRONMENTAL TECHNOLOGY; FLIP CHIP DEVICES; INTEGRATED CIRCUIT INTERCONNECTS; MICROELECTRONICS; RELIABILITY; RELIABILITY ANALYSIS;

ALTERNATIVE TECHNOLOGIES; ANISOTROPIC CONDUCTIVE ADHESIVES; COEFFICIENT OF MOISTURE EXPANSION; ENVIRONMENTAL-FRIENDLY; FLIP CHIP INTERCONNECTS; FLIP-CHIP INTERCONNECTION; MICROELECTRONICS ASSEMBLY; RELIABILITY PERFORMANCE;

ADHESIVE JOINTS;

EID: 84954056192     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271612     Document Type: Conference Paper

References (10)

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10. E. H. Wong, K. C. Chan, R. Rajoo & T. B. Lim, "The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging", Proc. 50th ECTC, (2000), pp. 576-580.