SCOPUS 정보 검색 플랫폼

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 1, 2001, Pages 24-32

Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substrates

(2) Yim, Myung Jin b Paik, Kyung Wook a,c

a IEEE

b IBM T J WATSON RESEARCH CENTER (United States)

c Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

Author keywords

Anisotropic conductive adhesive; Coefficient of thermal expansion; Flip chip; Nonconductive filler; Reliability

Indexed keywords

ADHESIVES; ANISOTROPY; ATMOSPHERIC HUMIDITY; CONDUCTIVE MATERIALS; DIFFERENTIAL SCANNING CALORIMETRY; FILLERS; SUBSTRATES; THERMAL CYCLING; THERMOGRAVIMETRIC ANALYSIS;

ANISOTROPIC CONDUCTIVE ADHESIVES; DYNAMIC MECHANICAL ANALYZERS (DMA); THERMOMECHANICAL ANALYZERS (TMA);

FLIP CHIP DEVICES;

EID: 0035279926 PISSN: 15213331 EISSN: None Source Type: Journal
DOI: 10.1109/6144.910798 Document Type: Article

Times cited : (45)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.