Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs

Microelectronics Reliability

Volumn 48, Issue 4, 2008, Pages 645-651

  Hwang, J S ^a  

^a Exax Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; CURING; ELASTIC MODULI; FILLERS; FLIP CHIP DEVICES; THERMAL EXPANSION;

CURE KINETICS; CURING PEAK TEMPERATURE; FLIP CHIP ASSEMBLY; NONCONDUCTIVE FILLERS;

CONDUCTIVE FILMS;

EID: 42649125269     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.10.004     Document Type: Article

References (17)

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