Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives

Microelectronics Reliability

Volumn 51, Issue 4, 2011, Pages 851-859

  Kim, Byeung Gee ^a   Lee, Sang Mok ^a   Jo, Yun Song ^a   Kim, Sun Chul ^a   Harr, Kyoung Moo ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING TECHNIQUES; BONDING TEMPERATURES; CHIP ON GLASS; ELECTRICAL MEASUREMENT; ELECTRICAL PROPERTY; FINE PITCH; FOUR-POINT PROBE METHOD; HIGH TEMPERATURE STORAGE TEST; HUMIDITY TESTS; NON-CONDUCTIVE ADHESIVES; OXIDIZED SI WAFERS; RELIABILITY TEST; RESISTANCE MEASUREMENT; SN BUMPS; THERMAL CYCLING TEST; THERMO-COMPRESSION; ULTRA FINE PITCH;

CONTACT RESISTANCE; ELECTRIC PROPERTIES; FLIP CHIP DEVICES; GLASS; RELIABILITY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; TESTING; TIN; WAFER BONDING;

GLASS BONDING;

EID: 79952184383     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2010.11.003     Document Type: Article

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