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Volumn , Issue , 2007, Pages 1084-1089

The resin core bump technology for COG (Chip on glass) application

Author keywords

Chip on glass; Fine pitch; Flip chip; LCD

Indexed keywords

CHIP ON GLASS; CONTACT RESISTIVITIES; CONVENTIONAL STRUCTURES; ELECTRICAL RESISTIVITY MEASUREMENTS; FINE PITCH; FLIP CHIP; INTERCONNECTION RELIABILITY; INTERCONNECTION TECHNOLOGY;

EID: 84871235470     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (5)
  • 1
    • 0024934653 scopus 로고    scopus 로고
    • Chip on glass technology for large capacity and high resolution LCD
    • M. Masuda et al, "Chip on Glass Technology for Large Capacity and High Resolution LCD", Proceeding of the 1989 Japan IEMT Symposium, pp.57-60
    • Proceeding of the 1989 Japan IEMT Symposium , pp. 57-60
    • Masuda, M.1
  • 2
    • 0032068978 scopus 로고    scopus 로고
    • Micropitch connection using anisotropic conductive materials for driver IC attachment to a liquid crystal display
    • H. Nishida et al, "Micropitch connection using anisotropic conductive materials for driver IC attachment to a liquid crystal display", IBM Journal of Research and Development, Volume 42, Numbers 3/4, 1998.
    • (1998) IBM Journal of Research and Development , vol.42 , Issue.3-4
    • Nishida, H.1
  • 3
    • 33748790398 scopus 로고    scopus 로고
    • Anisotropic conductive films (ACFs) for ultra-fine pitch chip-on-glass (COG) applications
    • January
    • M.J. Yim et al, "Anisotropic conductive films (ACFs) for ultra-fine pitch Chip-On-Glass (COG) applications", International Journal of Adhesion and Adhesives Volume 27, Issue 1, January 2007, Pages 77-84.
    • (2007) International Journal of Adhesion and Adhesives , vol.27 , Issue.1 , pp. 77-84
    • Yim, M.J.1
  • 4
    • 0036890938 scopus 로고    scopus 로고
    • Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects
    • December
    • Y. W. Chiu et al, "Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects", Microelectronics Reliability, Volume 42, Issue 12, December 2002, Pages 1945-1951.
    • (2002) Microelectronics Reliability , vol.42 , Issue.12 , pp. 1945-1951
    • Chiu, Y.W.1
  • 5
    • 31544466522 scopus 로고    scopus 로고
    • Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications
    • August
    • M. J. Yim et al, "Recent advances on anisotropic conductive adhesives (ACAs) for flat panel displays and semiconductor packaging applications", International Journal of Adhesion and Adhesives, Volume 26, Issue 5, August 2006, Pages 304-313.
    • (2006) International Journal of Adhesion and Adhesives , vol.26 , Issue.5 , pp. 304-313
    • Yim, M.J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.