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Volumn , Issue , 2007, Pages 1084-1089
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The resin core bump technology for COG (Chip on glass) application
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Author keywords
Chip on glass; Fine pitch; Flip chip; LCD
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Indexed keywords
CHIP ON GLASS;
CONTACT RESISTIVITIES;
CONVENTIONAL STRUCTURES;
ELECTRICAL RESISTIVITY MEASUREMENTS;
FINE PITCH;
FLIP CHIP;
INTERCONNECTION RELIABILITY;
INTERCONNECTION TECHNOLOGY;
ELECTRIC CONDUCTIVITY;
GLASS;
LIQUID CRYSTAL DISPLAYS;
MICROELECTRONICS;
SUBSTRATES;
TESTING;
THERMAL CYCLING;
RESINS;
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EID: 84871235470
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (3)
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References (5)
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