Interconnection with copper pillar bumps : Process and applications

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 214-216

  Lee, C H ^a  

^a Amkor Technology Korea Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PILLARS; CU BUMPS; CU PILLAR; ELECTRICAL PERFORMANCE; FINE PITCH; FLIP CHIP TECHNOLOGIES; GREEN SOLUTION; MIGRATION EFFECTS;

EID: 70349469831     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090391     Document Type: Conference Paper

References (3)

1. Prismark Partners LLC, "The Electronics Industry Report", 2003.
2. Andy Longford & Dick James, "Copper Pillar Bumps in Intel Microprocessors" Advanced Packaging Conference, Semi Europa 2006, Apr 2006.
3. Joachim Kloeser & Ernst-A Weibbach, "High-performance flip chip packages with copper pillar bumping", Global SMT & Packaging, May, 2006.