Correlation of material properties to reliability performance of anisotropic conductive adhesive flip chip packages

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 1, 2005, Pages 157-164

  Teo, Mary ^a,b   Mhaisalkar, Subodh G ^b   Wong, E H ^c   Teo, Poi Siong ^c   Wong, C C ^b   Ong, Kristine ^b   Goh, Chin Foo ^b   Teh, Lay Kuan ^b  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Adhesive interconnection; Anisotropic conductive adhesives (ACAs); Correlation; Flip chip; Reliability

Indexed keywords

ADHESIVES; AGING OF MATERIALS; ANISOTROPY; CORRELATION THEORY; ELASTIC MODULI; FLIP CHIP DEVICES; MICROELECTRONICS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; STRENGTH OF MATERIALS;

ADHESIVE INTERCONNECTION; ANISOTROPIC CONDUCTIVE ADHESIVES (ACAS); CORRELATION ANALYSIS; FLIP CHIP PACKAGES;

ELECTRONICS PACKAGING;

EID: 15744366372     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.843175     Document Type: Article

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