Measurements of solder bump lifetime as a function of underfill material properties

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 2, 1998, Pages 281-287

  Nysæther, Jon B ^b,c   Lundström, Pontus ^d   Liu, Johan ^a,e  

^a IEEE

^b UNIVERSITY OF OSLO   (Norway)

^c SINTEF   (Norway)

^d ERICSSON RADIO SYSTEMS AB   (Sweden)

^e SWEREA IVF   (Sweden)

Author keywords

Environmental testing; Flip chip devices; Plastics; Reliability; Soldering; Underfill

Indexed keywords

AGING OF MATERIALS; EUTECTICS; PLASTICS; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICE TESTING; SOLDERING; THERMAL CYCLING; THERMAL EXPANSION;

FLIP CHIP ON BOARD (FCOB) CIRCUITS; SOLDER BUMP LIFETIME; UNDERFILL MATERIALS;

FLIP CHIP DEVICES;

EID: 0032089697     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.705476     Document Type: Article

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