SCOPUS 정보 검색 플랫폼

Volumn 12, Issue 3, 2012, Pages 612-615

Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)

(3) Hong, Myung Hwan a Kim, Sun Chul a Kim, Young Ho a

a Hanyang University (South Korea)

Author keywords

Anisotropic conductive film (ACF); Chip on glass (COG) bonding; Insulating layer

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS; AU BUMP; BONDING TECHNIQUES; CONDUCTIVE PARTICLE; ELECTRICAL RESISTANCES; EXPOSURE-TIME; INSULATING LAYER; INSULATING LAYERS; INSULATING POLYMER; PROBE METHODS; SIDE WALLS; SINGLE LAYER; TWO-POINT; ULTRA FINE PITCH;

GOLD; INSULATING MATERIALS; LIGHT SENSITIVE MATERIALS; PHOTOSENSITIVE GLASS; PHOTOSENSITIVITY; POLYMERS;

GLASS BONDING;

EID: 84857457367 PISSN: 15671739 EISSN: None Source Type: Journal
DOI: 10.1016/j.cap.2011.07.016 Document Type: Article

Times cited : (15)

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