Development of thermal compression bonding with non conductive paste for 3DIC fine pitch copper pillar bump interconnections

2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011

Volumn , Issue , 2011, Pages 329-332

  Chan, Chien Feng ^a   Tseng, Wen Tsung ^a   Huang, Huei Nuan ^a   Huang, Pin ^a   Chan, Mu Hsuan ^a   Lin, Chun Tang ^a   Liu, Mark ^a   Chiu, Chi Hsin ^a   Chiu, Steve ^a   Ma, Mike ^a  

^a SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER PILLARS; DIE AREA; DIE SIZE; ELECTRICAL PERFORMANCE; FINE PITCH; GEL TIME; HIGH-DENSITY INTERCONNECTION; INTEGRATED CIRCUIT INDUSTRIES; KEY TECHNOLOGIES; MELTING TIME; MICRO-BUMPS; NON CONDUCTIVE PASTES; PROCESS PARAMETERS; RELIABILITY TEST; SOLDER BUMP; TEST VEHICLE; THERMAL COMPRESSION BONDING; UNDERFILLING; UNDERFILLS; WIDTH CONTROL;

FLIP CHIP DEVICES; MOBILE DEVICES; THREE DIMENSIONAL;

ELECTRONICS PACKAGING;

EID: 84860913915     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2011.6184439     Document Type: Conference Paper

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