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Volumn 127, Issue 1, 2005, Pages 29-32

Various adhesives for flip chips

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE PASTES; ADHESIVES; BONDING; CONDUCTIVE FILMS; COOLING; CURING; ELECTRONICS PACKAGING; GOLD; RELIABILITY;

EID: 18744386697     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1846064     Document Type: Article
Times cited : (16)

References (13)
  • 3
    • 0041908213 scopus 로고    scopus 로고
    • Development of a reliable packaging process for flip chip on ceramics
    • Zhong, Z., 2001, "Development of a Reliable Packaging Process for Flip Chip on Ceramics," Microelectron. Int., 18(1), pp. 19-22.
    • (2001) Microelectron. Int. , vol.18 , Issue.1 , pp. 19-22
    • Zhong, Z.1
  • 4
    • 0042907343 scopus 로고    scopus 로고
    • Flip chip assemblies using gold bumps and adhesive
    • Zhong, Z., 2001, "Flip Chip Assemblies Using Gold Bumps and Adhesive," Microelectron. Int., 18(3), pp. 15-19.
    • (2001) Microelectron. Int. , vol.18 , Issue.3 , pp. 15-19
    • Zhong, Z.1
  • 5
    • 0034915606 scopus 로고    scopus 로고
    • Reliability of flip chips on FR-4 assembled with reduced process steps
    • Zhong, Z., 2001, "Reliability of Flip Chips on FR-4 Assembled with Reduced Process Steps," Circuit World, 27(3), pp. 26-30.
    • (2001) Circuit World , vol.27 , Issue.3 , pp. 26-30
    • Zhong, Z.1
  • 6
    • 0013460150 scopus 로고    scopus 로고
    • Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill
    • Zhong, Z., 1999, "Assembly and Reliability of Flip Chip on Boards Using ACAs or Eutectic Solder with Underfill," Microelectron. Int., 16(3), pp. 6-14.
    • (1999) Microelectron. Int. , vol.16 , Issue.3 , pp. 6-14
    • Zhong, Z.1
  • 7
    • 2742572755 scopus 로고
    • Chip-on-glass mounting technology of LSIs for LCD module
    • Bessho, Y. et al., 1990, "Chip-On-Glass Mounting Technology of LSIs for LCD Module," IMC'90, pp. 183-189.
    • (1990) IMC'90 , pp. 183-189
    • Bessho, Y.1
  • 8
    • 0004832829 scopus 로고    scopus 로고
    • Flip chip bonding primer
    • September
    • Potter, B., 1998, "Flip Chip Bonding Primer," Circuits Assembly, September, pp. 72-75.
    • (1998) Circuits Assembly , pp. 72-75
    • Potter, B.1
  • 13
    • 0034981715 scopus 로고    scopus 로고
    • Stud bump bond packaging with reduced process steps
    • Zhong, Z., 2001, "Stud Bump Bond Packaging with Reduced Process Steps," Soldering Surf. Mount Technol., 13(2), pp. 35-38.
    • (2001) Soldering Surf. Mount Technol. , vol.13 , Issue.2 , pp. 35-38
    • Zhong, Z.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.