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Volumn 127, Issue 1, 2005, Pages 29-32
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Various adhesives for flip chips
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESIVE PASTES;
ADHESIVES;
BONDING;
CONDUCTIVE FILMS;
COOLING;
CURING;
ELECTRONICS PACKAGING;
GOLD;
RELIABILITY;
ASSEMBLY YIELDS;
GOLD BUMPS;
REDUCED PACKAGING TIME;
UNDERFILL CURING;
FLIP CHIP DEVICES;
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EID: 18744386697
PISSN: 10437398
EISSN: None
Source Type: Journal
DOI: 10.1115/1.1846064 Document Type: Article |
Times cited : (16)
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References (13)
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