Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages

Microelectronics Reliability

Volumn 44, Issue 2, 2004, Pages 295-302

  Wu, Y P ^a,b   Alam, M O ^a   Chan, Y C ^a   Wu, B Y ^a,b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; BOND STRENGTH (MATERIALS); CONDUCTIVE MATERIALS; FLIP CHIP DEVICES; FRACTOGRAPHY; GLASS; IMPACT TESTING; PACKAGING MATERIALS; SCANNING ELECTRON MICROSCOPY; SENSORS; SUBSTRATES; THICKNESS MEASUREMENT;

ADHESION STRENGTH; ANISOTROPICALLY CONDUCTIVE FILMS (ACF); FLIP CHIP ON FLEXIBLE (COF); FLIP CHIP ON GLASS (COG);

MICROELECTRONICS;

EID: 0942299008     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(03)00214-2     Document Type: Article

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