Wafer-level flip chip packages using preapplied anisotropic conductive films (ACFs)

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 30, Issue 3, 2007, Pages 221-227

  Son, Ho Young ^a   Chung, Chang Kyu ^a   Yim, Myung Jin ^a,b   Hwang, Jin Sang ^a   Paik, Kyung Wook ^a   Jung, Gi Jo ^c   Lee, Jun Kyu ^c  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Georgia Institute of Technology   (United States)

^c NEPES Corporation   (South Korea)

Author keywords

Anisotropic conductive film (ACF) prelamination; Flip chip assembly; Reliability; Wafer level flip chip packages; Wafer level package

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS (ACFS); CHIP-ON-BOARD (COB); CHIP-ON-FLEX (COF); ULTRAFINE-PITCH FLAT PANEL DISPLAY; WAFER-LEVEL PACKAGING (WLP);

ANISOTROPY; CONTACT RESISTANCE; ELECTRONICS PACKAGING; HIGH TEMPERATURE PROPERTIES; MECHANICAL PROPERTIES; THERMAL CYCLING; WAFER BONDING;

FLIP CHIP DEVICES;

EID: 34547096506     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2007.899151     Document Type: Article

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