Highly reliable non-conductive adhesives for flip chip CSP applications

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 26, Issue 2, 2003, Pages 150-155

  Yim, Myung Jin ^a   Hwang, Jin Sang ^a   Kwon, Woonseong ^b   Jang, Kyung Woon ^b   Paik, Kyung Wook ^b  

^a Telephus Inc   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Au bump; Chip size package; Flip chip; Nonconductive adhesives; Reliability

Indexed keywords

ADHESIVES; CURING; EPOXY RESINS; FILLERS; FLIP CHIP DEVICES; OPTIMIZATION; RELIABILITY; SOLDERING ALLOYS; STRAIN; SUBSTRATES; THERMAL CYCLING; THERMAL EXPANSION;

NONCONDUCTIVE ADHESIVES; NONCONDUCTIVE FILLERS;

CHIP SCALE PACKAGES;

EID: 0242355163     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2003.817715     Document Type: Article

References (6)

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