Ultrasonic bonding using anisotropic conductive Films (ACFs) for flip chip interconnection

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 4, 2009, Pages 241-247

  Lee, Kiwon ^a   Kim, Hyoung Joon ^a   Yim, Myung Jin ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Adhesives; Bonding; Flip chip; Interconnections; Ultrasonic

Indexed keywords

ADHESION STRENGTHS; ANISOTROPIC CONDUCTIVE FILMS; BONDING BEHAVIOR; BONDING PROCESS; BONDING TEMPERATURES; BONDING TIME; DYNAMIC SCANNING; FLIP CHIP; FLIP CHIP BONDING; FLIP-CHIP INTERCONNECTION; FR4 SUBSTRATES; GLASS SUBSTRATES; IN-SITU TEMPERATURE; INTERCONNECTIONS; LONGITUDINAL VIBRATIONS; ROOM TEMPERATURE; SUBSTRATE HEATING; SUBSTRATE MATERIAL; SUBSTRATE TEMPERATURE; THERMO-COMPRESSION; ULTRASONIC BONDING; ULTRASONIC VIBRATION;

ADHESION; ADHESIVES; ANISOTROPY; BOND STRENGTH (MATERIALS); CONDUCTIVE FILMS; CURING; DIES; FLIP CHIP DEVICES; GLASS; SUBSTRATES; ULTRASONIC EFFECTS; ULTRASONIC WAVES; ULTRASONICS; VIBRATION ANALYSIS;

GLASS BONDING;

EID: 70350339128     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2027894     Document Type: Article

References (6)

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