Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates

Microelectronics Reliability

Volumn 44, Issue 9-11 SPEC. ISS., 2004, Pages 1305-1310

  Frisk, L ^a   Seppala A ^a   Ristolainen, E ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; ELECTRIC RESISTANCE; FAILURE (MECHANICAL); LIQUID CRYSTAL POLYMERS; REAL TIME SYSTEMS; RELIABILITY; SOLDERED JOINTS;

BONDING PRESSURE; TEMPERATURE CYCLING TESTS;

FLIP CHIP DEVICES;

EID: 4544224903     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.07.014     Document Type: Conference Paper

References (10)

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