The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing

Soldering and Surface Mount Technology

Volumn 17, Issue 2, 2005, Pages 40-48

  Rizvi, M J ^a,b   Chan, Y C ^a   Bailey, C ^b   Lu, H ^b   Sharif, A ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Adhesion; Ageing (materials); Films (states of matter); Strength of materials

Indexed keywords

ADHESION; AGING OF MATERIALS; COMPOSITE MATERIALS; CONDUCTIVE FILMS; CROSSLINKING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; STRENGTH OF MATERIALS;

ANISOTROPIC CONDUCTIVE FILMS (ACF); BONDING TEMPERATURES; FILMS (STATES OF MATTER); METAL-COATED POLYMERS;

CURING;

EID: 21044434640     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910510597492     Document Type: Article

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