Evaluating fine-pitch chip-on-flex with non-conductive film by using multi-points compliant bump structure

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 324-329

  Huang, Yu Wei ^a   Lu, Su Tsai ^a   Chen, Tai Hong ^a  

^a INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COMPETITION; CONDUCTIVE FILMS; CONDUCTIVE MATERIALS; ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; INDUSTRIAL ECONOMICS; INDUSTRIAL MANAGEMENT; INTERCONNECTION NETWORKS; LIQUID CRYSTAL DISPLAYS; TECHNOLOGY; TESTING;

APPLICATIONS.; BONDING JOINTS; BONDING PROCESSES; BONDING TEMPERATURES; BONDING TIME; CHIP-ON-FLEX; COMPLIANT BUMP; CURING DEGREE; DAISY CHAINING; DRIVER IC; EFFECT OF TEMPERATURE; FLIP CHIP TECHNOLOGIES; HIGH-DENSITY PACKAGING; LOW COSTS; LOW-TEMPERATURE PROCESSING; MARKET SHARES; MULTI-POINTS; PACKAGING TECHNOLOGIES; PEELING STRENGTH; RELIABILITY TESTING;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50249097672     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342737     Document Type: Conference Paper

References (9)

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