A study on copper pillar interconnect in flip-chip-on-module packaging

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 325-330

  Huang, Mark ^a   Yeow, Ong Gee ^b   Poo, Chia Yong ^a   Jiang, Tom ^a  

^a MICRON TECHNOLOGY INC   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ARSENIC COMPOUNDS; BRAZING; CHIP SCALE PACKAGES; CHLORINE COMPOUNDS; COPPER; COPPER ALLOYS; ELECTRIC BATTERIES; ELECTRON BEAM LITHOGRAPHY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HIGH TEMPERATURE SUPERCONDUCTORS; INTERMETALLICS; LEAD; METALS; PRESSURE VESSELS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERED JOINTS; SOLDERING ALLOYS; TECHNOLOGY; TIN; TIN ALLOYS; WEIGHT CONTROL; WELDING;

BOND PADS; COPPER MIGRATION; ENERGY DISPERSIVE X RAYS; FLIP CHIPPING; FLIP-CHIP PACKAGING; HIGH TEMPERATURE STORAGE; HIGH-DENSITY; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER; MODULE PACKAGING; ORGANIC SOLDERABILITY PRESERVATIVE; PACKAGING TECHNOLOGIES; RELIABILITY PERFORMANCE; RELIABILITY TESTING; SCANNING ELECTRON MICROSCOPES; SEM-EDX; SN-AG-CU; SOLDER PASTES; SURFACE FINISHING;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50149089243     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469775     Document Type: Conference Paper

References (12)

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