Nonconductive films (NCFs) with multifunctional epoxies and silica fillers for reliable NCFs flip chip on organic boards (FCOBs)

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 2, 2009, Pages 65-73

  Chung, ChaNg Kyu ^a   Paik, Kyug Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Electroplated Au bump, glass transition temperature (Tg); Multifunctional epoxy; Nonconductive films; Silica fillers; Stud Au bump; Thermal cycling reliability; Thermomechanical properties

Indexed keywords

ELECTROPLATED AU BUMP, GLASS TRANSITION TEMPERATURE (TG); MULTIFUNCTIONAL EPOXY; NONCONDUCTIVE FILMS; SILICA FILLERS; STUD AU BUMP; THERMAL CYCLING RELIABILITY; THERMOMECHANICAL PROPERTIES;

APPLICATIONS; CURING; ELASTIC MODULI; EPOXY RESINS; FILLERS; FLIP CHIP DEVICES; FUNCTIONAL POLYMERS; GLASS; GLASS TRANSITION; ION BEAMS; RELIABILITY; SILICA; STUDS (FASTENERS); STUDS (STRUCTURAL MEMBERS); SUPERCONDUCTING TRANSITION TEMPERATURE; THERMAL CYCLING; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT; THERMOSETS;

GOLD;

EID: 67349107168     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2015287     Document Type: Article

References (13)

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