Non-conductive adhesive (NCA) trapping study in chip on glass joints fabricated using Sn bumps and NCA

Materials Transactions

Volumn 49, Issue 9, 2008, Pages 2100-2106

  Lee, Sang Mok ^a   Kim, Byeung Gee ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Chip on glass; Electro plating; Flip chip; Nonconductive adhesive; Tin bump

Indexed keywords

ABS RESINS; FILLERS; FLIP CHIP DEVICES; GLASS; GOLD; SOLDERED JOINTS; TIN; TITANIUM COMPOUNDS;

AU BUMPS; CHIP ON GLASS; CONDUCTIVE ADHESIVES; ELECTRICAL TESTS; ELECTRO PLATING; FLIP CHIP; IN CHIPS; NONCONDUCTIVE ADHESIVE; NONCONDUCTIVE ADHESIVES; SN BUMPS;

GLASS BONDING;

EID: 54549125822     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.MRA2008071     Document Type: Article

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