Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature

Microelectronics Reliability

Volumn 42, Issue 8, 2002, Pages 1185-1194

  Chan, Y C ^a   Luk, D Y ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ALUMINA; ANISOTROPY; CONDUCTIVE FILMS; CURING; FLIP CHIP DEVICES; NICKEL;

CONDUCTIVE ADHESIVE INTERCONNECTS;

ELECTRONICS PACKAGING;

EID: 0036681696     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00079-3     Document Type: Article

References (7)

1. Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications
2. Development of high-density interconnection techniques for contactless smart cards
3. Flip chip attachment using anisotropic conductive adhesives and electroless nickel bumps
4. Effect of misalignment on the electrical characteristics of anisotropic conductive adhesive joints
5. Conductive adhesive flip-chip bonding for bumped and unbumped die
6. Electric field effects on short-circuiting between adjacent joints in fine pitch anisotropically conductive adhesive interconnects
7. Thermal and thermo-oxidative ageing of an epoxy adhesive