The effect of fillers in nonconductive adhesive on the reliability of chip-on-glass bonding with Sn/Cu bumps

Materials Transactions

Volumn 52, Issue 11, 2011, Pages 2106-2110

  Kim, Byeung Gee ^a   Kim, Sun Chul ^a   Dong, Wen Guo ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

Chip on glass; Nonconductive adhesive; Tin copper bump

Indexed keywords

CHIP-ON-GLASS; DOUBLE LAYERS; FAILURE MECHANISM; FAILURE RATE; FLUOROPOLYMER; INDIUM TIN OXIDE; NON-CONDUCTIVE ADHESIVES; NONCONDUCTIVE ADHESIVE; OXIDIZED SI WAFERS; REFLOW PROCESS; SILICA FILLER; THERMO-COMPRESSION;

CONTACT RESISTANCE; FILLERS; FLUORINE CONTAINING POLYMERS; GLASS; RELIABILITY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON COMPOUNDS; SILICA; SILICON WAFERS; THERMAL CYCLING; TIN; TIN OXIDES; WAFER BONDING;

GLASS BONDING;

EID: 80655129328     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.M2011207     Document Type: Article

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