High-speed flex-on-board assembly method using anisotropic conductive films (ACFs) combined with room temperature ultrasonic (US) bonding for high-density module interconnection in mobile phones

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 530-536

  Lee, Kiwon ^a   Oh, Sangmin ^b   Saarinen, Ilkka J ^b   Pykari, Lasse ^b   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS; BONDING CHARACTERISTICS; BONDING METHODS; BONDING PARAMETERS; BONDING PRESSURE; BONDING PROCESS; BONDING TEMPERATURES; BONDING TIME; DAISY-CHAIN RESISTANCE; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICAL RESISTANCES; HIGH TEMPERATURE STORAGE TEST; HIGH-DENSITY; HIGH-SPEED; ROOM TEMPERATURE; THERMAL CYCLING TEST; VIBRATION AMPLITUDE;

CONDUCTIVE FILMS; ELECTRIC PROPERTIES; MECHANICAL PROPERTIES; MOBILE DEVICES; MOBILE PHONES; MOBILE TELECOMMUNICATION SYSTEMS; OPTIMIZATION; SOLDERING ALLOYS; TELEPHONE; TELEPHONE SETS; THERMAL CONDUCTIVITY;

CELLULAR TELEPHONE SYSTEMS;

EID: 79960389581     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898562     Document Type: Conference Paper

References (4)

1. Savolainen, P. et al, "High-density Interconnections in Mobile Phones Using ACF", Polytronics 2004, AP22
2. Lee, K. et al, "Ultrasonic Bonding Using Anisotropic Conductive Films (ACFs) for Flip Chip Interconnection", IEEE Transactions on electronic packaging manufacturing, Vol. 32, p. 241-247, 2009
3. Lee, K. et al, "Ultrasonic Anisotropic Conductive Films (ACFs) Bonding of Flexible Substrates on Organic Rigid Boards at Room Temperature", 57th Electronic Components and Technology Conference, Reno, Nevada, USA, May 29 - June 1, 2007
4. Tolunay, M. N. et al, "Heating and bonding mechanisms in ultrasonic welding of thermoplastics", Polymer engineering and science, Vol. 23, No. 13, 1983