Moisture effects on reliability of non-conductive adhesive attachments

PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photon

Volumn , Issue , 2008, Pages

  Saarinen, K ^a   Heino, P ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

Finite element method; Humidity test; Moisture; Non conductive adhesive; Reliability

Indexed keywords

ELECTRONIC DEVICE; ENVIRONMENTAL TEST; HUMIDITY TEST; HUMIDITY TESTS; MINIATURISATION; MOISTURE EFFECTS; NON-CONDUCTIVE ADHESIVE; NON-CONDUCTIVE ADHESIVES; ROHS DIRECTIVE; SOLDER JOINTS;

ADHESIVES; ENVIRONMENTAL TESTING; FAILURE ANALYSIS; MICROELECTRONICS; MOISTURE; POLYMERS;

FINITE ELEMENT METHOD;

EID: 77950883574     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PORTABLE-POLYTRONIC.2008.4681297     Document Type: Conference Paper

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