Design and understanding of Anisotropic Conductive Films (ACF's) for LCD packaging

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 2, 1998, Pages 226-234

  Yim, Myung Jin ^a,b   Paik, Kyung Wook ^a,b  

^a IEEE   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Anisotropic conductive films; Au coated polmer balls; Conduction mechanism; Connection resistance; Contact resistance; Epoxy resins; Interconnection; LCD packaging; Ni balls

Indexed keywords

ELECTRIC CONDUCTIVITY OF SOLIDS; ELECTRONICS PACKAGING; EPOXY RESINS; FINITE ELEMENT METHOD; LIQUID CRYSTAL DISPLAYS; MATHEMATICAL MODELS; OHMIC CONTACTS;

CHIP ON FILM (COF) PACKAGING TECHNOLOGY; CHIP ON GLASS (COG) PACKAGING TECHNOLOGY;

CONDUCTIVE FILMS;

EID: 0032090590     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.705468     Document Type: Article

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