Development and reliability of non-conductive adhesive flip-chip packages

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 446-453

  Teh, L K ^a   Anto, E ^a   Wong, C C ^a   Mhaisalkar, S G ^a   Wong, E H ^b   Teo, P S ^b   Chen, Z ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Flip chip assembly; Modeling; Non conductive adhesives; Reliability

Indexed keywords

FLIP CHIP ASSEMBLY; MOISTURE DIFFUSION; NON CONDUCTIVE ADHESIVES;

ADHESIVES; COMPRESSIVE STRENGTH; COMPUTER SIMULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; STRESS RELAXATION; VISCOELASTICITY;

CHIP SCALE PACKAGES;

EID: 4344624100     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.077     Document Type: Article

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