Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection

Microelectronics Reliability

Volumn 46, Issue 5-6, 2006, Pages 774-785

  Chen, Xu ^a   Zhang, Jun ^a   Jiao, Chunlei ^b   Liu, Yanmin ^b  

^a TIANJIN UNIVERSITY   (China)

^b Jiya Mobile Display Inc   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ATMOSPHERIC HUMIDITY; DETERIORATION; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; POLYTETRAFLUOROETHYLENES; STRENGTH OF MATERIALS;

ADHESIVE STRENGTH; ANISOTROPIC CONDUCTIVE FILM (ACF); BONDING PRESSURE; CURING TIME;

CONDUCTIVE FILMS;

EID: 33645142204     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2005.07.115     Document Type: Conference Paper

References (21)

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