Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Materials Science and Engineering R: Reports

Volumn 51, Issue 1-3, 2006, Pages 1-35

  Li, Yi ^a   Wong, C P ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

Conductive adhesives; Die attach; Electronic packaging; Lead free; Self assembled monolayer; Tin lead alloys

Indexed keywords

ADHESIVES; ELECTRIC CONDUCTANCE; LEAD ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

CONDUCTIVE ADHESIVES; DIE ATTACH; LEAD FREE; TIN-LEAD ALLOYS;

ELECTRONICS PACKAGING;

EID: 33644780882     PISSN: 0927796X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mser.2006.01.001     Document Type: Review

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