The reliability of 30 μm pitch COG joints fabricated using Sn/Cu bumps and non-conductive adhesive

EMAP 2007 - International Conference on Electronic Materials and Packaging 2007

Volumn , Issue , 2007, Pages

  Kim, Byeung Gee ^a   Lee, Sang Mok ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ABS RESINS; FLIP CHIP DEVICES; GOLD; PHOTORESISTS; SILICON COMPOUNDS; TIN;

ELECTRONIC MATERIALS AND PACKAGING; INTERNATIONAL CONFERENCES; NON-CONDUCTIVE ADHESIVE;

GLASS BONDING;

EID: 51249120919     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2007.4510304     Document Type: Conference Paper

References (13)

1. J.C. Hwang, IEEE Transaction on Components Packaging Manufacturing Technology-Part A, 18(3) (1995), 458-461.
2. S.Y. Kim, T-S. Oh, W.J. Lee, and Y.-H. Kim, International Conference on Electronics Packaging Technology, (2006), 414-417.
3. th Int'l Symposium on Advanced Packaging Materials, (2004), 7-10.
4. M. Y. Yim, J. S. Hwang, and K. W. Paik, International Journal of Adhesion & Adhesives, 27 (2007), 77-84.
5. I. Watanabe, Y. Gotoh, and K. Kogayashi, Asia Display, (2001), 553-555.
6. J.-W. Kim, W.-C. Moon, and S.-B. Jung, 83(11-12) (2006), Microelectronic Engineering, 2335-2340
7. C.W. Tan, Y.C. Chan, and N.H. Yeung, Microelectronics Reliability, 43 (2003), 481-486
8. U.-B. Kang, and Y.-H. Kim, IEEE Transactions on Components and Packaging Technologies, 27(2) (2004), 254-258.
9. H. Kristiansen, J. Liu, "Overview of conductive adhesive interconnection technologies for LCDs", IEEE TransCPMT-A, vol. 17, No. 2 (1998), pp. 208-214.
10. th Electronic Components and Technology Conf, San Diego, May. 2002, pp. 1385-1389.
11. B.Y. Kim, Z.G. Chen, Y-H Kim, " The COG Bonding using Sn Bump and Non-conductive Adhesive", MICRO SYSTEM technologies, (2005), pp. 582-585.
12. S.M. Lee, B.Y. Kim, Y-H Kim, "The Chip-on Glass Bonding using Non-Conductive Adhesive and Sn bump: Effect of Sn bump Types on the NCA Trapping", Proc Int. Conf. on Electronics Packaging, Tokyo, April. 2006, pp. 48-52.
13. Z.G. Chen, Y-H Kim, "A new COP bonding using nonconductive adhesives for LCDs driver IC packaging", Displays, Vol 27, No 3, (2006), pp. 130-135.