SCOPUS 정보 검색 플랫폼

Microsystem Technologies

Volumn 17, Issue 4, 2011, Pages 685-691

A novel chip-on-glass method for slim LCD packaging

(3) Lin, You Hung a Chang, Kang J b Wang, Gou Jen c

a WINTEK Corporation (Taiwan)

b CALIFORNIA STATE UNIVERSITY (United States)

c NATIONAL CHUNG HSING UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS; BONDING PRESSURE; CHIP ON GLASS; ELECTRICAL CONDUCTIVITY; HEAD TEMPERATURE; LCD PANELS; LIQUID-CRYSTAL DISPLAY PANELS; PROCESS PARAMETERS; PRODUCTION LINE; TEFLON FILMS; UNEVEN SURFACES; YIELD RATES;

CHIP SCALE PACKAGES; CONDUCTIVE FILMS; ELECTRIC CONDUCTIVITY; GLASS; POLISHING; POLYTETRAFLUOROETHYLENES; SURFACE ROUGHNESS;

LIQUID CRYSTAL DISPLAYS;

EID: 79958814743 PISSN: 09467076 EISSN: None Source Type: Journal
DOI: 10.1007/s00542-010-1160-3 Document Type: Conference Paper

Times cited : (1)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.