Highly Reliable Flip-Chip-on-Flex Package Using Multilayered Anisotropic Conductive Film

Journal of Electronic Materials

Volumn 33, Issue 1, 2004, Pages 76-82

  Yim, Myung Jin ^a   Hwang, Jin Sang ^a   Kim, Jin Gu ^a   Ahn, Jin Yong ^a   Kim, Hyung Joon ^b   Kwon, Woonseong ^b   Paik, Kyung Wook ^b  

^a Telephus Inc   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Adhesion; Anisotropic conductive film; Chip on film (COF); Flip chip; Reliability

Indexed keywords

ADHESION; ANISOTROPY; ATMOSPHERIC HUMIDITY; FLIP CHIP DEVICES; HIGH TEMPERATURE EFFECTS; LIQUID CRYSTAL DISPLAYS; POLYIMIDES; THERMAL CYCLING; THERMAL STRESS; WETTING;

ANISOTROPIC CONDUCTIVE FILMS (ACF); CHIP-ON-FLIM (COF); FLIP CHIPS; RELIABILITY ANALYSIS;

CONDUCTIVE FILMS;

EID: 0742268460     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0297-1     Document Type: Article

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