Thermal-mechanical process simulation of an advanced NCF technology

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 4, 2009, Pages 301-310

  Cheng, Hsien Chie ^a   Hwang, Wan Yu ^b   Kao, Kuo Shu ^c   Tsang, Jimmy ^c   Yang, Sterling S ^c   An, Chao Chyun ^d   Chang, Simon M ^d  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

^c TFT LCD Association   (Taiwan)

^d INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Contact resistance measurement; Finite element (FE) modeling; Flip chip; Interconnect reliability; Nonconductive film; Process simulation; Twyman Green interferometry technique

Indexed keywords

FINITE-ELEMENT (FE) MODELING; FLIP CHIP; INTERCONNECT RELIABILITY; NONCONDUCTIVE FILM; PROCESS SIMULATION; TWYMAN-GREEN INTERFEROMETRY TECHNIQUE;

CHIP SCALE PACKAGES; CONTACT RESISTANCE; ELECTRIC RESISTANCE MEASUREMENT; INTERFEROMETERS; MECHANICAL ENGINEERING; RELIABILITY; TECHNOLOGY;

INTERFEROMETRY;

EID: 70350340319     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2030958     Document Type: Article

References (15)

1. K. Hatada, H. Fujimoto, T. Kawakita, and T. Ochi, "A newLSI bonding technology: Micro bump bonding assembly technology," Proc. IEEE-CHMT pp. 45-49, 1988.
2. J. Liu, "An overview of advances of conductive adhesive joining technology in electronics applications," Mater. Technol., vol. 10, pp. 247-252, 1995.
3. R. Aschenbrenner,A. Ostmann, G. Motulla, and E. Zakel, "Flip chip attachment using ansiotropic conductive adhesives and electroless nickel bumps," IEEE Trans. Compon., Packag., Manuf. Technol.-Part C, vol. 20, no. 2, pp. 95-100, Apr. 1997.
4. D. Lu, Q. K. Tong, and C. P. Wong, "Mechanism underlying the unstable contact resistance of conductive adhesives," IEEE Trans. Electron. Packag. Manuf., vol. 22, no. 3, pp. 228-232, Jul. 1999.
5. K. N. Chiang, C. W. Chang, and J. D. Lin, "Process modeling and thermal/mechanical behavior of ACA/ACF type flip-chip packages," ASME Trans. J. Electron. Packag., vol. 123, pp. 331-337, 2001.
6. M. J. Yim, J. S. Hwang, W. S. Kwon, K. W. Jang, and K. W. Paik, "Highly reliable non-conductive adhesives for flip chip CSP applications," IEEE Trans. Electron. Packag. Manuf., vol. 26, no. 2, pp. 150-155, Apr. 2003.
7. H. C. Cheng, C. L. Ho, K. N. Chiang, and S. M. Chang, "Process-dependent contact characteristics of NCA assemblies," IEEE Trans. Compon. Packag. Technol., vol. 27, no. 2, pp. 398-410, Jun. 2004.
8. S. M. Chang, J. H. Jou, A. Hsieh, T. H. Chen, J. N. Jao, and H. S. Wu, "Internal stress and connection resistance correlation study of microbump bonding," IEEE Trans. Compon. Packag. Technol., vol. 24, no. 3, pp. 493-499, Sep. 2001.
9. H. C. Cheng, C. L. Ho, W. C. Chen, and S. S. Yang, "A study of process-induced deformations of anisotropic conductive film (ACF) assembly," IEEE Trans. Compon. Packag. Technol., vol. 29, no. 3, pp. 577-588, Sep. 2006.
10. H. C. Cheng, J. Lin, W. H. Chen, Y. Y. Hsu, and R. H. Uang, "Process-dependent thermal-mechanical analysis and design of a novel nanowire-based anisotropic conductive film assembly," in Proc. IMPACT, Taipei, Taiwan, Oct. 18-20, 2006.
11. G. N. Ellison, Thermal Computations for Electronic Equipment. Malabar, FL: R. E. Krieger, 1989.
12. G. Ridsdale, B. Joiner, J. Bigler, and V. M. Torres, "Thermal performance limits of the QFP family," IEEE Trans. Compon., Packag. Manuf. Technol.-Part A, vol. 17, no. 4, pp. 427-443, Dec. 1996.
13. D. Post, B. Han, and P. Ifju, High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials. New York: Springer-Verlag, 1994.
14. R. S. Timsit, "Electrical contact resistance: Properties of stationary interfaces," IEEE Trans. Compon. Packag. Technol., vol. 22, no. 1, pp. 85-98, Mar. 1999.
15. H. C. Cheng, K. N. Chiang, C. K. Chen, and J. C. Lin, "Solder joint reliability of thermal enhanced BGA using a finite-volume-weighted averaging technique," J. Chinese Inst. Eng., vol. 24, no. 4, pp. 439-451, Jul. 2001.