Ultrasonic bond process for polymer-based anisotropic conductive film joints. Part 2: Application in chip-on-FR4 board assemblies

Polymer Testing

Volumn 30, Issue 4, 2011, Pages 449-456

  Lin, Y C ^a   Fang, Xiao Nan ^a   Jiang, Yu Qiang ^a   Jin, Hao ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Anisotropic conductive film (ACF); Bond strength; Chip on FR4 board; Degree of cure; FTIR

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS; BOND STRENGTH; CHIP-ON-FR4 BOARD; DEGREE OF CURE; FTIR;

ANISOTROPY; BOND STRENGTH (CHEMICAL); BOND STRENGTH (MATERIALS); CHIP SCALE PACKAGES; CURING; POLYMERS; ULTRASONICS;

CONDUCTIVE FILMS;

EID: 79953702556     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2011.03.003     Document Type: Article

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