Effects of the functional groups of nonconductive films (NCFs) on material properties and reliability of NCF flip-chip-on-organic boards

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 3, 2007, Pages 464-471

  Chung, Chang Kyu ^a   Kwon, Woon Seong ^a   Jang, Kyung Woon ^b   Park, Jin Hyoung ^a   Lee, Soon Bok ^a   Paik, Kyung Wook ^b  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

Interfacial delamination; Nonconductive films (NCFs); Shear strain; Thermal cycling reliability; Thermal deformation; Thermomechanical properties

Indexed keywords

INTERFACIAL DELAMINATION; NONCONDUCTIVE FILMS (NCFS); THERMAL CYCLING RELIABILITY; THERMAL DEFORMATION; THERMOMECHANICAL PROPERTIES;

ACOUSTIC MICROSCOPES; CURING; DEFORMATION; FLIP CHIP DEVICES; FUNCTIONAL GROUPS; FUNCTIONAL POLYMERS; GLASS TRANSITION; INTERFEROMETERS; INTERFEROMETRY; ION BEAMS; POLYMER FILMS; QUALITY ASSURANCE; RELIABILITY ANALYSIS; RESINS; SHEAR STRAIN; STEEL SHEET; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

THERMAL EXPANSION;

EID: 65449128459     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.898738     Document Type: Article

References (11)

1. M. J. Yim, J. S. Hwang, W. S. Kwon, K. W. Jang, and K. W. Paik, "High reliable non-conductive adhesives for flip chip CSP application," in Proc 52th Electron. Comp. Technol. Conf, 2002, pp. 1385-1389.
2. J. Liu, Conductive Adhesive for Electronics Packaging. Port Erin, UK: Electrochemical Publ., Ltd., 1999, pp. 12-13.
3. X. Zhang, E. H. Wong, R. Rajoo, M. K. Iyer, J. F. J. M. Caers, and X. J. Zhao, "Assembly process modeling for flip chip on flex interconnections with non-conductive adhesive," in Proc 5th Electron. Packag. Technol. Conf., 2003, pp. 803-808.
4. H. Li, K. S. Moon, Y. Li, L. Fan, J. Xu, and C. P. Wong, "Reliability enhancement of electrically conductive adhesives in thermal shock environment," in Proc 54th Electron. Comp. Technol. Conf, 2004, pp. 165-169.
5. W. S. Kwon, M. J. Yim, S. J. Ham, S. B. Lee, and K. W. Paik, "Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation," ASME Trans-J. Electron. Packag., vol. 127, no. 2, pp. 86-90, 2005.
6. D. Post, B. T. Han, and P. Ifju, High Sensitivity Moiré. New York: Springer, 1994, pp. 50-52, 135-136.
7. W. Wang, J. Sun, and X. Qian, "New three-dimensional displacement measurement system: Modified four-beam moiré interferometer-Twyman/Green," Opt. Eng., vol. 44, no. 1, pp. 013608.1-013608.6, 2005.
8. K. W. Jang, W. S. Kwon, M. J. Yim, and K. W. Paik, "Effects of silica filler and diluent on material properties and reliability of nonconductive pastes (NCPs) for flip-chip applications," IEEE Trans. Comp. Packag. Technol., vol. 27, no. 3, pp. 608-615, Sep. 2004.
9. U. W. Gedde, Polymer Physics. London, UK: Chapman & Hall, 1995, pp. 78-81.
10. W. S. Kwon, S. Y. Yang, S. B. Lee, and K. W. Paik, "The effect of Tg on thermomechanical deformation and reliability of adhesive flip chip assemblies during temperature cycling," in Proc. Electron. Comp. Technol. Conf, 2004, pp. 1731-1737.
11. J. H. Park, C. K. Chung, K. W. Paik, and S. B. Lee, "Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF)," Key Eng. Mater., vol. 326-328, no. 1, pp. 517-520, 2006.