Ultrasonic Anisotropic Conductive Films (ACFs) bonding of flexible substrates on organic rigid boards at room temperature

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 480-486

  Lee, Kiwon ^a   Kim, Hyoung Joon ^a   Kim, Il ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANISOTROPY; CONTACT RESISTANCE; FOURIER TRANSFORM INFRARED SPECTROSCOPY; SUBSTRATES; ULTRASONICS;

ELECTRICAL CONTINUITY; ORGANIC RIGID BOARDS; ROOM TEMPERATURE; ULTRASONIC VIBRATION;

CONDUCTIVE FILMS;

EID: 35348834113     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373841     Document Type: Conference Paper

References (2)

1. Kiwon Lee, Hyoung Joon Kim, Myung Jin Yim, and Kyung Wook Paik, "Curing and Bonding Behaviors of Anisotropic Conductive Films (ACFs) by Ultrasonic Vibration for Flip Chip Interconnection", 56th Electronic Components and Technology Conference, San Diego, California, USA, May 30 - June 2, 2006
2. M. N. Tolunay, P. R. Dawson, and K. K. Wang, "Heating and bonding mechanisms in ultrasonic welding of thermoplastics", Polymer engineering and science, Vol. 23, No. 13, 1983