Process-dependent contact characteristics of NCA assemblies

IEEE Transactions on Components and Packaging Technologies

Volumn 27, Issue 2, 2004, Pages 398-410

  Cheng, Hsien Chie ^a   Ho, Cheng Lin ^a   Chiang, Kuo Ning ^b   Chang, Shyh Ming ^c  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^c INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ADHESIVES; BONDING; COMPUTER SIMULATION; ELECTRIC CONTACTS; ELECTRIC RESISTANCE MEASUREMENT; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; THERMOANALYSIS;

BUMP HEIGHT UNIFORMITY; CONTACT MECHANICS; CONTACT RESISTANCE; FOUR POINT PROBE METHOD; MICROBUMP BONDING TECHNOLOGIES; NONCONDUCTIVE ADHESIVES; PARAMETRIC STUDY;

ELECTRONICS PACKAGING;

EID: 3242811241     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.828552     Document Type: Article

References (16)

1. K. Hatada, H. Fujimoto, T. Kawakita, and T. Ochi, "A new LSI bonding technology: micro bump bonding assembly technology," in Proc. IEEE/CHMT Int. Electronic Manufacturing Technology Symp., Oct. 1988, pp. 23-27.
2. K. Hatada, H. Fujimoto, T. Ochi, and Y. Ishida, "LED array modules by new technology: microbump bonding method," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 13, pp. 521-527, Sept. 1990.
3. T. Yoshida, H. Fujimoto, K. Hatada, Y. Ikeda, K. Takahashi, S. Fujita, M. Sagawa, H. Sakai, and K. Inoue, "A new millimeter-wave IC on Si substrate using MBB technology," in Proc. 18th IEEE/CPMT Int. Conf., 1996, pp. 56-59.
4. S. Ito, M. Mizutani, H. Noro, M. Kuwamura, and A. Prabhu, "A novel flip chip technology using nonconductive resin sheet," in Proc. IEEE Electronic Components and Technology Conf., 1998, pp. 1047-1051.
5. H. Kristiansen and J. Liu, "Overview of conductive adhesive interconnection technologies for LCDs," IEEE Trans. Comp., Packag., Manufact. Technol. A, vol. 21, pp. 223-232, June 1997.
6. A. Aschenbrenner, R. Misßner, and H. Reichl, "Adhesive flip chip bonding on flexible substrates," in Proc. IEEE PEP'97 Conf., 1997, pp. 86-94.
7. J. Liu, "On the failure mechanism of anisotropically conductive adhesion joints on copper metallization," Int. J. Adhesion Adhesives, vol. 16, no. 4, pp. 285-287, 1996.
8. H. Kristiansen, M. Gulliksen, H. Haugerud, and R. Friberg, "Characterization of electrical contacts made by nonconductive adhesive," in Proc. 3rd Int. Adhesive Joining and Coating Technology in Electronics Manufacturing, Sep. 1998, pp. 345-350.
9. E. Nicewarner, "Interconnect resistance characteristics of several flip-chip bumping and assembly techniques," Microelectron. Reliab., vol. 39, pp. 113-121, 1999.
10. R. S. Timsit, "Electrical contact resistance: properties of stationary interfaces," IEEE Trans. Comp. Packag. Technol., vol. 22, pp. 85-98, Mar. 1999.
11. K. Keswick, R. L. German, M. Breen, and R. Nolan, "Compliant bumps for adhesive flip-chip assembly," IEEE Trans. Comp., Packag., Manufact. Technol. B, vol. 18, pp. 503-509, Aug. 1995.
12. J. Liu, Conductive Adhesives for Electronics Packaging. London, U.K.: Electrochemical Publications, Ltd., 1999.
13. S. M. Chang, J. H. Jou, H. S. Wu, H. Y. Lin, and C. Y. Wu, "Stress analysis of micro-bump bonding structure for chip-on-glass packaging," in Proc. 5th Asian Symp. Information Display, 1999, pp. 79-83.
14. ANSYS User's Manual, ANSYS Inc., 2003.
15. H. C. Cheng, K. N. Chiang, C. K. Chen, and J. C. Lin, "Solder joint reliability of thermal enhanced BGA using a finite-volume-weighted averaging technique," J. Chinese Inst. Eng., vol. 24, no. 4, July 2001.
16. S. M. Chang, J. H. Jou, A. Hsieh, T. H. Chen, C. Y. Chang, Y. H. Wang, H. Y. Lin, and C. M. Huang, "Characteristic study of chip-on-film interconnection," in Proc. Int. Optoelectronics Symp. Photonics, Taipei, Taiwan, R.O.C., July 2000, pp. 228-239.