Overview of conductive adhesive interconnection technologies for LCD's

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 21, Issue 2, 1998, Pages 208-214

  Kristiansen, Helge ^b   Liu, Johan ^a,c  

^a IEEE

^b SINTEF   (Norway)

^c SWEREA IVF   (Sweden)

Author keywords

Anisotropic conductive adhesive; Chip on glass; High density interconnect; LCD driver connection; Nonconductive adhesive; Tape automated bonding

Indexed keywords

ADHESIVES; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; LIQUID CRYSTAL DISPLAYS; THERMOPLASTICS;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); CHIP ON GLASS (COG); ISOTROPIC CONDUCTIVE ADHESIVES (ICA);

CONDUCTIVE MATERIALS;

EID: 0032093924     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.705466     Document Type: Review

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