Effects of ultrasonic bonding process on polymer-based anisotropic conductive film joints in chip-on-glass assemblies

Polymer Testing

Volumn 30, Issue 3, 2011, Pages 318-323

  Lin, Y C ^a   Jin, Hao ^a   Fang, Xiao Nan ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Anisotropic conductive film (ACF); Bonding strength; Chip on Glass (COG); Curing degree

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS; BOND STRENGTH; BONDING FORCES; BONDING STRENGTH; BONDING TIME; CHIP-ON-GLASS (COG); CURING DEGREE; DEGREE OF CURE; ELECTRONIC PACKAGING; IN-CHIP; INTERCONNECT APPLICATIONS; OPTIMUM VALUE; THERMOSONIC FLIP-CHIP BONDING; ULTRASONIC BONDING; ULTRASONIC POWER;

ANISOTROPY; BOND STRENGTH (CHEMICAL); BOND STRENGTH (MATERIALS); CHIP SCALE PACKAGES; CONDUCTIVE FILMS; CURING; DIFFUSION BONDING; GLASS; POLYMERS; ULTRASONICS;

GLASS BONDING;

EID: 79951559713     PISSN: 01429418     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymertesting.2010.12.006     Document Type: Article

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