Characterization of Nonconductive Adhesives for Flip-Chip Interconnection

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 271-276

  Teh, Lay Kuan ^a   Wong, Chee Cheong ^a   Mhaisalkar, Subodh ^a   Ong, Kristine ^a   Teo, Poi Siong ^b   Wong, Ee Hua ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Characterization; Flip chip; Nonconductive adhesives; Reliability

Indexed keywords

ADHESIVES; CHARACTERIZATION; COMPRESSIVE STRESS; DIFFUSION; FILLERS; GOLD; MOISTURE; NICKEL; RELIABILITY; SHEAR STRENGTH; SWELLING;

HYGROSCOPIC SWELLING; INTERCONNECTION; MECHANICAL CONNECTION; NONCONDUCTIVE ADHESIVES;

FLIP CHIP DEVICES;

EID: 2342471397     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0132-8     Document Type: Article

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